The device is mainly applied for the pre-heating processing for
thermo-set resin material such as melamine, epoxy molding compound
, bakelite and urea formaldehyde molding powder , etc., including
preformed project such as compressed molding ,transfer molding and
extrusion molding , etc.. The H.F. Preheating process is widely applied for Thermo-set
plastic molding such as for electric components , mechanical parts
, bakelite products , urea formaldehyde plastics products, melamine
tablewares , and packaging of IC , commutator , transistors and
other micro-electronic components . The device can be used to improve the surface glossiness of
products , prevent water-like wrinkle and strengthen the fluidness
of powder resin . It can pre-heat and soften the powder resin (
caking ) prior to the plastic packaging for the electronic
components and semi-conductor IC , so as to improve the grade and
performance for the products . High-Frequency Pre-heater: Flat Electrode Type and Roller Electrod Typ